Yantai Tightsen Fine Chemicals Technology Co., LTD.,

Laptops, tablets, phones • Touch screen bonding • Frame bracket bonding • Cover plate bonding and sealing • Frame side edge sealing adhesive • Iithium battery fixation • Speaker, camera module bonding and sealing • Battery cover plate bonding

CCM module, VCM motor, fingerprint module

CCM module • Fixation between lens barrel and holder • Fixation between lend holder and pcb • Adhesion between IR glass and Holder • Dust capture adhesive • Wscape hole blocking sealing • DA procedure adhesive • AA procedure adhesive • FPC reinforcement • Bracket adhesion

Characteristic High toughness, high strength, high attachment, low precipitation, low shrinkage, low water absorption, high moisture resistance

Lens

Base

Sensor

Conductive fabric Rigid-Flex PCB Connector

5)Reinforcement between substrate and FPC

2)Adhesion between IR and Holder

1)Adhesion between Die attach/silicon wafer and substrate

4)Lens Holder with PCB fixed

VCM

Characteristic High toughness, high strength, high attachment, low precipitation, low shrinkage, low water absorption, high moisture resistance

VCM motor • Outer shell • Reed • Magnet • Base • Adhesion and fixation of riveting point and other parts

Magnet

coil + carrier

pin foot

lower reed

lower cover

upper reed

thermosetting adhesive

soldering paste/elargol

thermosetting adhesive

Iron shell

Characteristic low temperature curing High toughness, high strength, high attachment, low precipitation, low shrinkage, low water absorption, high moisture resistance

Fingerprint module • Metal ring fixation • Glass and sensor • Sensor molding material • Chip bottom filling • Wire key seal • FPC reinforcement • Hard coating material

PCB

fingerprint sensor

FPC

IC chip

lower cover

thermosetting adhesive

cover plate (coating)

Metal rack

metal cover

Choose the right product for your business